Formulated for electrical potting and encapsulation applications, Master Bond EP36AO from Master Bond (Hackensack, NJ) combines high thermal conductivity with thermal stability. It is serviceable from -80°F to 500°F, has a tensile strength of over 2,000 psi, and can adhere to metallic and non-metallic substrates. Once cured, it features a dielectric strength of 400 volts/mil and a volume resistivity of 2-3 x 1012 ohm-cm when measured at 25°C. The EP36AO is a one component system that doesn’t require mixing and it offers flexible cure schedules. Curing times can be shortened at higher temperatures. It is available in pints, quarts, gallons, and five gallon containers.
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