Master Bond EP21FL from Master Bond (Hackensack, NJ) is a two part epoxy resin system that features low to moderate viscosity. It is well suited for potting, coating, and sealing electronic assemblies and can bond dissimilar substrates with different coefficients of expansion. This adhesive has a service temperature range of -60 degrees F to 250 degrees F. The typical viscosity of Part A is 4,000 cps at 25 degrees C and 10,000 cps at 25 degrees C for Part B. This system produces high strength castings, bonds, and seals which are resistant to thermal cycling and shock.
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