TTM Technologies, Inc. (TTM), a manufacturer of advanced electronics and interconnect solutions, opened its new Ultra-High-Density Interconnect (Ultra-HDI) printed circuit board manufacturing facility in Syracuse, New York.
The California-based company purpose-built the 215,000-square-foot factory to serve aerospace and defense programs. TTM expects the project to create up to 400 engineering and manufacturing jobs, bringing its total Central New York workforce to nearly 1,000 employees.
"This investment strengthens the U.S. microelectronics supply chain, deepens our commitment to Central New York and positions TTM to support the next generation of defense and national security technologies for decades to come," TTM EVP and President of Aerospace & Defense Cathie Gridley said.
Ultra-HDI PCBs, which enable miniaturization and performance density in advanced electronics, support multiple next-generation defense platforms, including radar systems, missile defense architectures, space-based sensors and autonomous systems. According to TTM, domestic production capacity for these advanced board technologies has been severely limited, with the majority of global manufacturing concentrated in Asia.
The company will receive a $30 million grant from the Department of Defense. Additionally, Empire State Development (ESD) will provide up to $17 million in performance-based Excelsior Jobs Tax Credits in exchange for the creation of 400 new jobs and the retention of more than 600 existing jobs in New York. ESD also awarded TTM a $5 million capital grant from the Upstate Revitalization Initiative for reimbursement for machinery and equipment.
First announced in November 2023 and celebrated with a beam-signing ceremony in October 2024, the facility builds on TTM's more than 60-year manufacturing presence in Syracuse.
