Master Bond (Hackensack, NJ) had developed a thermally-conductive epoxy system that is designed to mitigate the issues associated with tightly-packed components and miniaturized electronic circuits. With a thermal conductivity of 22 BTU/in/ft²/hr/ºF and serviceability from -60 to 400°F, the EP21ANHT delivers in demanding microelectronic applications, according to the company. The two-component adhesive uses a 1:1 mix ratio by weight or volume and offers room temperature curing, or accelerated curing at higher temperatures. The tensile shear strength is greater than 1,000 psi.
Head on over to www.masterbond.com to get more details.
