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EpoTek Adhesive With iCure Thermal Spot Curing vs. Conventional Oven

Tue, 02/22/2011 - 12:34pm
IRphotonics

A series of tests have been carried out to compare two curing processes for a heat curing adhesive, namely conventional oven curing and the iCure AS200 infrared thermal spot curing system from IRphotonics. The results show that tested samples are equally cured with both methods but the curing time is reduced with the iCure.

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