Product Releases

Cubitron II Abrasives

Fri, 11/09/2012 - 3:20pm
3M Abrasive Systems

3M Abrasive Systems (St. Paul, MN) has introduced 3M™ Cubitron™ II Bonded Abrasive Grinding and Cut-Off Wheels, a revolutionary new technology that reinvents the grinding process, says the company. With Cubitron II abrasives, users can get precision-shaped grain technology that cuts faster, stays sharper longer, and requires less pressure than conventional grinding and cut-off wheels. In addition, the abrasives can help reduce operator fatigue and increase productivity. The precision-shaped grains in Cubitron II grinding wheels continuously fracture to form sharp points and edges. This technology helps Cubitron II abrasives slice cleaner and faster, stay cooler, and last longer than conventional wheels.

To learn more about Cubitron II abrasives, visit


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