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Thermally-Conductive Adhesives

Thu, 09/02/2010 - 12:31pm

The Master Bond EP30FLAO (Hackensack, NJ) is a two-component epoxy resin system for high performance potting, bonding, sealing, and coating. The low-viscosity epoxy is ideal as a thermally-conductive potting compound, and has a wide service temperature range of 4K to 250°F, plus a thermal conductivity of 9-10 BTU/in/ft²/hr/ºF. According to the company, it has a low thermal expansion coefficient in addition to good dimensional stability, physical strength, and toughness.

For more information, visit www.masterbond.com.

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