Product Releases

An Inorganic-Based Epoxy

Tue, 04/26/2011 - 6:19am

Master Bond (Hackensack, NJ) has developed the EP30LTE-LO, which uses a special blend of polymeric and inorganic materials. The two-component epoxy combines outstanding performance with a low thermal expansion coefficient. According to the company, it is serviceable over the wide range of -60 to 250°F, and cures at room temperature, with 85 percent of its maximum strength developed within 48 hours. The 100 percent reactive epoxy features a coefficient of thermal expansion of 12x10-6 in/in/°C and shrinks less than 0.0002 in/in. It also bonds well to metals, glass, ceramics, wood, rubbers, and most plastic.

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