Product Releases

Solder Paste Gets Better

Wed, 09/29/2010 - 3:59am

FCT Assembly (Milpitas, CA) has introduced its RMA250 Solder Paste, which is a rosin-based chemistry designed to provide repeatability and consistency in the printing process. The paste offers an extended abandon time and excellent soldering activity with all surface finishes, according to the company. Additional features include:

  • The ability to exceed the requirements for ANSI/J-STF -004, -005, as well as all Bellcore test criteria for solder pastes.
  • Surface area ratios (SAR) as low as 0.55 when used with the UltraSlic stencil technology.
  • A low voiding/high reliability composition.

Check out to get more information.


Share This Story

You may login with either your assigned username or your e-mail address.
The password field is case sensitive.